Infineon Technologies CoolMOS™ P7

EBV presents the combination of the latest CoolMOS™ P7 technology with the innovative SOT-223 package

EBV presents the combination of the latest CoolMOS™ P7 technology with the innovative SOT-223 package brings best price/performance superjunction technology together with a cost-effective package solution. The SOT-223 package without middle pin is fully compatible to the footprint of a DPAK and therefore allows one-on-one drop-in replacements and second sourcing – benefiting from lower costs, space saving in designs with low power dissipation at a comparable thermal behaviour to DPAK. The portfolio offers products in 600 V, 700 V and 800 V from an RDS(on) range of 360 mΩ - 4500 mΩ.

 

Key features

• Drop-in-replacement for DPAK at lower cost
• Space savings in designs with low power dissipation
• Comparable thermal behavior to DPAK
• Supports increased switching frequency to reduce magnetics

 

Additional features

• Best fit for target applications in terms of
  • Thermals and efficiency
  • Ease-of-use level
  • EMI behavior

 

Applications

• Adapter
• Charger
• Lighting
• TV

ebv content library/npi/2018/infineon-technologies-coolmostm-p7 Infineon Technologies CoolMOS™ P7 in SOT-223 | EBV Elektronik