How Chip-on-Board Technology is Driving a New Era of Embedded Intelligence
Smaller, smarter, stronger
The future belongs to those who rethink what’s possible. Across life sciences, logistics, smart homes, and consumer appliances, the race is on to create products that are not just connected but truly intelligent, efficient, and secure. Achieving this next level of innovation requires bold choices in both technology and design. One solution leading the charge is Chip-on-Board (CoB) technology: a compact, dual-band Wi-Fi solution that redefines how next-generation products are designed and built. By integrating a complete System-on-Chip (SoC) directly onto application-specific printed circuit boards (PcBs), this approach enables engineers to design smaller, smarter and more adaptable products without compromising performance.
Unlocking performance and flexibility through embedded design
Innovation thrives when technology becomes invisible. Performance, security, and connectivity then work seamlessly in the background. Unlike pre assembled modules, CoB platforms – such as NXP’s – bring all key hardware and software components together in a single, secure chip. These platforms
combine dual-band Wi-Fi (2.4 GHz & 5 GHz), Bluetooth® Low Energy (BLE) and open-standard protocols. All of these components are mounted directly onto a customized PCB.
This embedded approach goes beyond saving space. It provides complete control over critical design elements, including RF performance, security architecture, thermal management, memory capacity, and physical interfaces. Product teams can fine-tune devices to meet specific requirements, ensuring
strong connectivity, reliability and energy efficiency across a wide range of applications – from wearable medical devices to smart home appliances or industrial sensors.
Innovation without compromise: Cost, security and speed
SoC designs deliver more than performance. By embedding the chip directly onto the PCB, developers can reduce costs. They also enhance security and accelerate time-to-market by avoiding reliance on pre-assembled modules. Devices become harder to hack and easier to update. They are ready for global deployment.
This approach also opens new business opportunities. Companies can explore connected-product-as-a-service models. These models keep devices intelligent and adaptable long after they leave the factory. From smart plugs to connected appliances, the possibilities for differentiation are endless.
The future of product innovation is embedded
We stand at the edge of a new frontier. Connected products are more than just tools – they’re experiences. Embedded solutions like NXP’s Chip-on-Board technology represent a shift toward products that are smaller, smarter, secure, scalable, cost-effective, and sustainable.
With embedded solutions, innovation teams gain the freedom to move faster and think bigger. They can create products that not only meet today’s needs but help shape the future. The principle is simple: smarter products start with smarter design.
In a market where every millimeter of board space and every micro-watt of power defines your competitive edge, “good enough” connectivity is no longer an option. Our Chip-on-Board solutions give you the architectural freedom to strip away the bulk and double down on intelligence, security, and scale. Don’t just build a product, build the benchmark for your industry. Visit Verhaert’s website to discover technical blueprints, explore real-world use cases, and discover how technologies like NXP can turn your next design concept into a market leader.
Want to discover more about this project? Please contact Dirck Seynaeve - dirck.seynaeve@verhaert.com
Our partnership with EBV Elektronik, established in January 2025, has been a catalyst for growth. Together, we have successfully integrated Verhaert’s cutting-edge solutions into a wider industrial landscape, leveraging EBV’s prestigious brand and deep-rooted community to connect with the visionaries of tomorrow. It is a collaboration built on mutual excellence and a shared commitment to the future of embedded technology.
