Powering your FPGA

Infineon PoL (Point of Load) solutions

As functionality & CPU current increases in new FPGA applications also power density becomes a key design consideration in space constrained storage, netcom and telecom applications,. Compared to traditional solutions using digital controller and external power-stages, this new solution integrates digital control and power in the same device and allows 1 MHz operations enabling 50% space saving compared to traditional solutions.

Infineon's PoL devices are step down (buck) switching integrators which integrate a controller, driver and MOSFETs into a single package. They offer a flexible and scalable solution and are optimized for 12 Vin applications, however also operate at 5 Vin. They operate across Industrial temperature range.
 

Infineon offers PMBus capable Multi-Output PMIC IRPS5401 for Next Generation FPGA/SoC from 10 W to 50 W

This PMIC can be used in applications for equipment with a large ASIC/Micro:

• FPGA e.g. Xilinx, Microsemi
• CPU e.g. NXP, ARM based CPUs

Reference design for Zynq UltraScale+

UltraZED™ SOM Zynq® UltraScale+ MPSoC System on Module powered by Infineon device IRPS5401MTRPBF

Xilinx Zynq UltraScale+ MPSoC Power Solutions – Reference Designs

• High Density for Small-form-factor PCBs. Four DC/DC outputs and one LDO output @ 24mm x 30mm Layout size including L’s & C’s
• Scalable Core and Platform Currents up to 40A+ (by using an external Power stage), 1% DC, 2% AC accuracy
• Proven Power for Xilinx Zynq UltraScale+, Zu02 to Zu19, CG, EG and EV options
• Low Power, Full Power and Power efficiency options for 0.72V, 0.85V, 0.9V
• Can be also used for critical voltages (e.g.  SERDES supply)
• Settable power sequencing integrated
• Fault Management, Telemetry and Margining
• See power maps for consolidated power rails for your solution

For easy developing the following Xilinx Zynq UltraScale+ MPSoC devices:

• XCZU3EG-1SFVA625
• XCZU2EG-1SFVA625
• XCZU3CG-1SFVA625
• XCZU2CG-1SFVA625