Infineon Technologies AIROC™

The AIROC™ CYW20835 Bluetooth^® LE SoC is a Bluetooth^® 5.2 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20835 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth^® low energy solutions.

Key features

• Bluetooth^® stack v5.2, Bluetooth^® low energy: industry's most widely deployed Bluetooth
• Secure over-the-air (OTA) firmware upgrade, RSA, X.509, SHA, AES128
• MCU Subsystem: 96-MHz Arm^® Cortex^® -M4, 384 KB SRA
• Package: 60-pin QFN (7 mm x 7 mm)

Additional features

• Supported in ModusToolbox™
• Most widely deployed wireless IP – more than 1 Billion wireless Infineon devices in the field
• Strength in Bluetooth^® classic complements Wi-Fi^® in streaming applications to ensure reliability
• Ultra-low power by design – very low sleep, transmit and receive current
• Best-in-class receiver sensitivity for Bluetooth^® LE and Bluetooth^® Classic (EDR) no connection drops
• Low latency, data delivery for HID, gaming, real-time sensors
• Faster throughput: 2 Mbps LE enables faster firmware updates
• Full driver integration and certified production modules for time to market advantage

Applications

• AIROC™ CYW20835 Bluetooth^® LE System on Chip