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Wide Bandgap Technology

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Developing for the future:

Image of CCPAK picture

We remain focused on the development of very high reliability-very high power GaN FETs, with continued development in:

  • Automotive qualification
  • 900 V and upwards
  • Half-bridge package solutions
  • Clip-bond packaging (CCPAK)
  • Bare die

 

 

 

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