Engicam is an innovative Italian technology company headquartered in Florence, specializing in high-performance embedded computing. Since its founding in 2004, Engicam has been designing and manufacturing System-on-Modules (SoMs), Computer-on-Modules (CoMs), carrier boards, and human-machine interfaces (HMIs) tailored to mission-critical industrial applications.
The company’s product portfolio leverages leading-edge processors from global-tier partners, including NXP®, STMicroelectronics®, Intel®, Rockchip®, Renesas®, and Texas Instruments®. Engicam emphasizes four core engineering principles: longevity, form factor minimization, robustness, and scalability. Our modules are built for long-term availability and are proven to operate in demanding thermal and mechanical conditions.
The company supports different module standards enabling scalable architectures and flexible system designs: SODIMM, MicroGEA, SMARC, QSeven and the latest proprietary form factor, TIA, the first release of a new generation of High-Performance AI Accelerators. Featuring dedicated NPUs delivering multiple TOPS of processing power, these platforms handle demanding AI workloads such as real-time video analytics, computer vision, robotics, and autonomous systems—combining high accuracy, ultra-low latency, and data center–level performance in embedded solutions.
Featured products
Engicam
TIA RZ/V2H
The new Engicam module is suitable for a wide range of applications (machine vision, autonomous robots, and factory automation). The SOM is based on RENESAS® RZ/V2H processor with AI accelerator (DRP-AI) with 8TOPS/dense, 80TOPS/sparse, GE3D 3D GPU.
Engicam
AI.DEV RZV2H
A powerful development kit with an industrial-grade board built on the TIA RZ/V2H System-on-Module. With the Renesas RZ/V2H processor and three built-in CSI cameras, it provides an optimized platform for advanced AI applications.
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