PSoC™ 6 family
The PSoC™ 6 family is built on an ultra-low-power architecture, and the MCUs feature low-power design techniques that are ideal for battery powered applications. The dual-core Arm® Cortex®-M4 and Cortex-M0+ architecture lets designers optimize for power and performance simultaneously. Using its dual cores combined with configurable memory and peripheral protection units, the PSoC™ 6 MCU delivers the highest level of protection defined by the Platform Security Architecture (PSA) from Arm.
PSoC™ 4 CapSense
CAPSENSE™ is the world's best capacitive sensing solution with industry-leading water tolerance and proximity sensing
Capacitive sensing for touch has changed the face of design in consumer and industrial products. Infineon CAPSENSE™ solutions bring elegant, reliable, and easy-to-use capacitive touch sensing functionality to your design, via PSoC™ Creator’s CAPSENSE™ component, ModusToolbox CAPSENSE™ Middleware or our Mechanical Button Replacement (MBR) portfolio. Our capacitive touch sensing solutions have replaced more than four billion mechanical buttons, and it enables hundreds of diverse types of sensing applications.
CAPSENSE™ offers industry leading low power operation, with an average current consumption of 22 μA, and the industry’s widest voltage ranges (1.71-5.5 V). CAPSENSE™ also provides the industry’s best solution for liquid tolerance to prevent false touches in wet/moist environments.
AIROC™ Wi-Fi + Bluetooh® Combos
Infineon's AIROC™ Wi-Fi & combos portfolio presents a comprehensive suite of solutions that seamlessly integrate IEEE 802.11a/b/g/n/ac/ax Wi-Fi and Bluetooth® 5.4 functionalities into a single-chip solution. This integration enables the development of compact IoT designs, catering to the growing demand for small-form-factor devices in the Internet of Things (IoT) landscape. The portfolio encompasses combo solutions, standalone Wi-Fi modules, and Wi-Fi System-on-Chips (SoCs) featuring embedded MCUs and on-chip networking capabilities, available in 1x1 SISO and 2x2 MIMO configurations. Furthermore, the Wi-Fi and combo solutions are designed to be seamlessly paired with external MCUs from Infineon and other manufacturers, supporting real-time operating systems (RTOS) as well as Linux on application processors, thereby facilitating the implementation of complete Wi-Fi + Bluetooth®/Bluetooth® Low Energy systems.
Focus products for Wi-Fi 4:
CYW43022
Ultra-low Power 1x1 Dual-band Wi-Fi 5 (802.11ac) + Bluetooth® 5.4 combo
Infineon’s AIROC™ CYW43022 an ultra-low power single-chip, combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 5 (802.11ac) and Bluetooth® 5.4. With a low-power architecture, the CYW43022 is ideal for battery powered applications where best-in-class power consumption is critical. An embedded Bluetooth stack and Wi-Fi networking offloads allow the CYW43022 to maintain connectivity activity even while a host processor is in low-power sleep mode. The CYW43022 supports 256-QAM enabling data rates up to 78 Mbps. On-chip power amplifier and low-noise amplifiers are included for both the 2.4 and 5GHz bands plus an internal +20dBm Bluetooth power amplifier.
CYW43012
1x1 Dual-band Wi-Fi 4 (802.11n) + Bluetooth® 5.4 combo
Infineon’s AIROC™ CYW43012 an ultra-low power single-chip, combo device features 1x1 dual-band 2.4 GHz and 5 GHz Wi-Fi 4 (802.11n) and Bluetooth® 5.4. With a low-power architecture, the CYW43012 is ideal for battery powered applications where best-in-class power consumption is critical. The CYW43012 provides 802.11ac friendliness by supporting 256-QAM (for 20 MHz channels in the 5 GHz band) enabling data rates up to 78 Mbps with 802.11ac access points. On-chip power amplifier and low-noise amplifiers are included for both the 2.4 and 5GHz bands.
Focus products for Wi-Fi 6:
CYW55573
Wi-Fi 6/6E tri-band 2x2 Wi-Fi and Bluetooth® 5.3 SoC
The AIROC™ CYW55573 is part of Infineon’s Wi-Fi 6/6E and Bluetooth® 5.3 SoC family. The solution supports Wi-Fi 6/6E features, is tri-band capable (2.4G, 5G, 6G). Its features improve range, power efficiency, network robustness, and security, while reducing the total Bill of Materials cost and board space. The solution delivers an exceptional high-quality video/audio streaming and seamless connectivity experience in congested network environments and significantly reduces latency by operating in the 6G spectrum.
AIROC™ Bluetooh® LE MCU
Focus products for Bluetooth® LE5.4:
Bluetooth® LE 5.4 MCU with Industry’s best range, Dual ARM Cortex M33 dedicated for applications and CAN FD
OPTIGA™ family
OPTIGA™ family combining state-of-the art hardware security controllers with software
Our OPTIGA™ family of security solutions is designed for easy integration into embedded systems to protect the confidentiality, integrity and authenticity of information and devices. These hardware-based security solutions scale from basic authentication chips to sophisticated implementations.
Focus product:
The easiest way to add Matter and security to your smart home devices
OPTIGA™ Trust M MTR is our OPTIGA™ Trust M discrete security solution combined with a Matter provisioning service. It is Matter-certified and works with any MCU/SoC, making it easy to add secured Matter compatibility to existing IoT designs. Working closely with our partner Kudelski IoT, we offer late-stage personalized Device Attestation Certificate injection to give OEMs the flexibility to update DACs right up until the start of production.
High performance memory solutions
Our distinct portfolio of volatile and non-volatile memories encompasses cutting-edge offerings tailored to meet diverse application requirements. This includes the SEMPER™ family of NOR Flash memories, renowned for their emphasis on safety, security, and reliability. Additionally, our EXCELON™ family comprises ultra-low power, high-performance, and dependable F-RAM products, catering to the evolving needs of memory-intensive applications. Moreover, our portfolio features HYPERBUS™ interface-based HYPERFLASH™ NOR Flash and HYPERRAM™ pSRAM memories, demonstrating our commitment to delivering innovative and high-speed memory solutions for modern electronic devices.
SEMPER™ NOR Flash
Key features:
- ASIL-B compliant and ASIL-D ready: Meets ISO 26262 standard for automotive functional safety
- IEC-61508 ready
- Endurance flex architecture: Multiple partitions each configurable to provide up to 25 years of data retention or 1+ million cycles endurance
- Diagnostics: SafeBoot and error checking to ensure safe and reliable operation
- Read bandwidth of up to 400 MB/s: High-performance to enable instant-on applications with XiP (eXecute in Place), for direct program execution from long-term storage instead of code shadowing to RAM
- Interfaces: Quad SPI and JEDEC xSPI-compatible Octal and HYPERBUS™
- Automotive grade: AEC-Q100 qualified and proven at extreme temperatures (-40°C to +125°C)
- Enhanced reliability: Supports ECC (SECDED) along with CRC protection over interface and memory data
- 10+ years supply and availability for long-life platforms
Infineon Technologies F-RAM
| |
QUAD SDI |
HYPERBUS™ |
Octal |
| Density |
512Mb - 2Gb |
512Mb - 2Gb |
512Mb - 2Gb |
| Short OPN |
S25HL512T / S25HL01GT / S25HL02GT / S25HS512T / S25HS01GT / S25HS02GT |
S26HL512T / S26HL01GT / S26HL02GT / S26HS512T / S26HS01GT / S26HS02GT |
S28HL512T / S28HL01GT / S28HS512T / S28HS01GT / S28HS02GT |
| Voltage |
166 MHz SDR / 102 MHz DDR @3.0V
166 MHz SDR / 102 MHz DDR @1.8V |
166 MHz DDR @3.0V
200 MHz DDR @1.8V |
166 MHz SDR / 166 MHz DDR @3.0V
166 MHz SDR / 200MHz DDR @1.8V |
| Temp |
Industrial (-40°C to +85°C)
Industrial Plus (-40°C to +105°C)
Auto Grade 3 (-40°C to +85°C)
Auto Grade 2 (-40°C to +105°C)
Auto Grade 1 (-40°C to +125°C) |
Industrial (-40°C to +85°C)
Industrial Plus (-40°C to +105°C)
Auto Grade 3 (-40°C to +85°C)
Auto Grade 2 (-40°C to +105°C)
Auto Grade 1 (-40°C to +125°C) |
Industrial (-40°C to +85°C)
Industrial Plus (-40°C to +105°C)
Auto Grade 3 (-40°C to +85°C)
Auto Grade 2 (-40°C to +105°C)
Auto Grade 1 (-40°C to +125°C) |
| Features |
Up to 2.56M cycles endurance
25 years data retention
ISO26262 ASIL B compliant
FMEDA & safety manual
SafeBoot & diagnostics
ECC (SECDED)
Memory CRC x1 boot option |
Up to 2.56M cycles endurance
25 years data retention
ISO26262 ASIL B compliant
FMEDA & safety manual
SafeBoot & diagnostics
ECC (SECDED)
Memory CRC
Interface CRC
x1 and x8 boot options |
Up to 2.56M cycles endurance
25 years data retention
ISO26262 ASIL B compliant
FMEDA & safety manual
SafeBoot & diagnostics
ECC (SECDED)
Memory CRC
Interface CRC
x1 boot options |
| Packages |
512Mb: 24-ball BGA, 16-pin SOIC, 8-contact WSON
1Gb: 24-ball BGA, 16-pin SOIC
2Gb: 24-ball BGA |
512Mb: 24-ball BGA
1Gb: 24-ball BGA
2Gb: 24-ball BGA |
512Mb: 24-ball BGA
1Gb: 24-ball BGA
2Gb: 24-ball BGA |
EXCELON™ F-RAM
The most energy efficient, high density, reliable data logging memories
EXCELON™, Infineon's next-generation Ferroelectric RAM (F-RAM) memory, delivers the industry’s lowest-power mission-critical nonvolatile memory, by combining ultra-low-power operation with high-speed interfaces, instant nonvolatility and unlimited read/write cycle endurance. This makes EXCELON™ the ideal data-logging memory for portable medical, wearable, IoT sensor, industrial and automotive applications.
Density: 2Mbit, 4Mbit, 8Mbit
Interface: SPI, QSPI
Key features:
- High performance - More than 10x increase in performance with a 108Mhz serial QSPI interface vs today's SPI FRAMs
- Ultra-Low-Energy - Up to 70x reduction in typ. standby currents vs. F-RAMs today, along with inrush current control
- Low Supply Voltage - Supports 1.71V to 1.89V operating voltage in addition to the wide voltage 1.8V to 3.6V range
- High Density - Industry’s highest density serial nonvolatile RAM offering up to 16Mbits of storage for datalogging
