KIOXIA
The Inventor of Flash Memory
KIOXIA Europe GmbH (formerly Toshiba Memory Europe GmbH) is the European based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). In 1984 Toshiba invented a new type of semiconductor memory called flash memory. Later in 1987, NAND flash memory was developed that raised electronic equipment to the next level. From the invention of flash memory to today’s breakthrough BiCS FLASHTM 3D flash memory, KIOXIA continues to provide embedded memory solutions for all kind of applications like consumer electronics, mobile technology, automotive and industrial applications such as robotics.
SLC NAND
Reliability and Performance
KIOXIA’s advanced Flash Memory technology offers SLC NAND providing best in class endurance and data retention for sensitive or frequently used data in a system. For long lasting products or systems working with extremely high data throughput between the host and the memory, KIOXIA SLC is the optimal solution.
| SPECIFICATIONS | |
|---|---|
| FEATURES | SLC NAND |
| Density | 1 Gbit − 256 Gbit |
| Technology | 24nm |
| ECC (Error Correction Code) | Required on Host Side |
| Temperature |
-40°C to 85°C |
| Package | TSOP and BGA |
BENAND™
SLC NAND with embedded ECC
BENAND™ (Built-in ECC NAND) is a SLC NAND memory device which has an internal hardware ECC engine. Using BENAND™ it is possible for customers to use the 24nm SLC NAND flash memory technology even when their platform cannot support higher bit ECC.
| SPECIFICATIONS | |
|---|---|
| FEATURES | BENAND™ (SLC+ECC) |
| Density | 1 Gbit − 8 Gbit |
| Technology | 24nm |
| ECC (Error Correction Code) | Embedded on Memory Chip |
| Temperature |
-40°C to 85°C |
| Package | TSOP and BGA |
SERIAL NAND
SLC NAND with Serial Peripheral Interface (SPI)
KIOXIA’s new line-up of 24nm-based Serial NAND flash memory products is compatible with the widely used Serial Peripheral Interface, giving users access to SLC NAND flash memory with a low pin count, small package and large capacity.
| SPECIFICATIONS | |
|---|---|
| FEATURES | SERIAL NAND |
| Density | 1 Gbit − 8 Gbit |
| Technology | 24nm |
| Interface | Quad-SPI (Serial Peripheral Interface) |
| ECC (Error Correction Code) | Embedded on Memory Chip |
| Temperature |
-40°C to 85°C |
| Package | 8 pin WSON |
MANAGED NAND
For efficient and easy to integrate storage systems, managed NAND like e-MMC and UFS are the preferred solutions. Offering broadly accepted standard interfaces and packages, in combination with high speed interfaces, they are the optimal selection for many applications in the industrial, mobile and automotive market.
e-MMC
Highly-efficient Storage
e-MMC is a family of advanced and highly efficient NAND flash memories with an integrated controller for enhanced memory management. Based on an interface standardized by JEDEC, KIOXIA’s e-MMC offers the optimal solution for applications where higher data volumes need to be stored in an efficient way.
| SPECIFICATIONS | ||
|---|---|---|
| FEATURES | e-MMC | EXTENDED TEMP. e-MMC |
| Density | 4 GB – 128 GB | 8 GB – 64 GB |
| Technology | 15nm / BiCS FLASH™ | 15nm |
| JEDEC Version | 5.0 / 5.1 | 5.1 |
| Temperature |
-25°C to 85°C |
-40°C to 105°C |
| Package | 153 ball FBGA (11.5 x 13 mm) | |
UFS
High Performance Storage
For applications demanding a superior interface performance, KIOXIA is offering a broad line-up of new UFS Memory products. Utilizing a full duplex serial high-speed interface, it is compliant with the latest UFS Version 2.1, 3.0 and 3.1. In combination with the embedded memory management, it offers a highly efficient and excellent performing storage solution. UFS memory with Version 3.1 enables next generation mobile devices to take full advantage of the connectivity benefits of 5G, leading to faster downloads and reduced lag time – and improved user
experience.
| SPECIFICATIONS | |
|---|---|
| FEATURES | UFS – UNIVERSAL FLASH STORAGE |
| Density | 32 GB – 1 TB |
| Technology | BiCS FLASH™ |
| JEDEC Version | 2.1 / 3.0 / 3.1 |
| Temperature |
-25°C to 85°C |
| Package | 153 ball FBGA (11.5 x 13 mm) |
KIOXIA – Embedded Flash Memory Line-Up Overview
| Density | Bit per Cell Technology | ||||||
|---|---|---|---|---|---|---|---|
| in GByte | in Gbit | 2D-SLC | 2D-MLC managed | 3D–TLC managed | |||
|
1Gb |
Raw SLC |
BENAND |
Serial NAND |
||||
| 2Gb | Raw SLC | BENAND | Serial NAND | ||||
| 4Gb | Raw SLC | BENAND | Serial NAND | ||||
| 8Gb | Raw SLC | BENAND | Serial NAND | ||||
| 16Gb | Raw SLC | ||||||
| 4GB | 32Gb | Raw SLC | e-MMC | ||||
| 8GB | 64Gb | Raw SLC | e-MMC | ||||
| 16GB | 128Gb | Raw SLC | e-MMC | e-MMC | |||
| 32GB | 256Gb | Raw SLC | e-MMC | e-MMC | UFS | ||
| 64GB | e-MMC | e-MMC | UFS | ||||
| 128GB | e-MMC | UFS | |||||
| 256GB | UFS | ||||||
| 512GB | UFS | ||||||
|
1TB (1024GB) |
UFS | ||||||
