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TMF8829 dToF Sensor – High Resolution Multi Zone Distance Sensing for Industrial Systems

Direct Time of Flight (dToF) enables precise, fast distance measurement and spatial awareness in compact embedded designs. The ams OSRAM TMF8829 integrates a SPAD based multi zone array, on chip processing, and a wide field of view to deliver stable ranging – even under challenging ambient light conditions. Ideal for robotics, presence detection, machine monitoring, and 3D sensing in industrial environments.
 

Why dToF for Engineers

Direct ToF vs. alternatives: dToF measures photon flight time from a 940 nm VCSEL pulse to the target and back to the SPAD detector, providing absolute distance (not just intensity). On chip histogramming and peak detection improve robustness against ambient light and lens smudges, enabling reliable, repeatable measurements in real world conditions.

 


Enter the TMF8829 dToF Engineering Raffle

Register to Win a TMF8829 MCU Shield Evaluation Board

Get the opportunity to receive a TMF8829 MCU Shield Board and evaluate multizone dToF performance directly in your own setup:

  • Highresolution ranging & accuracy 
  • Excellent ambientlight robustness 
  • Rawdata streaming for AI/ML, SLAM, sensorfusion pipelines 
  • Perfect for feasibility studies in robotics, presence sensing, and industrial HMI 

 

 

TMF8829_EVM_EB_Shield Evaluation Kit

 


 

TMF8829 – Key Technical Highlights

  • Multi zone depth sensing: configurable 8×8, 16×16, 32×32 up to 48×32 (max 1,536 zones) for detailed spatial maps. 
  • Range & optics: ~10 mm to 11 m detection, ~80° FOV (diag., 4:3) for wide angle coverage. 
  • SPAD + TDC + histogram engine with on-chip processing outputs distance, confidence, amplitude, and ambient light. 
  • Resolution & precision: reports depth with 0.25 mm resolution; tolerates cover-glass smudges; handles multiple objects per depth point
  • Interfaces: I3C/I²C compatible and SPI (incl. raw data streaming for external algorithms / AI). 
  • Integration: compact module 5.7 × 2.9 × 1.5 mm; –40 °C to +85 °C operating range. 


Industrial Use Cases

  • Robotics & AGVs: obstacle avoidance, cliff detection, room scanning, SLAM support. 
  • Presence / People Detection: privacy-preserving occupancy and approach sensing without RGB imaging. 
  • Machine Monitoring & Safety: proximity and zone control in automation cells. 
  • Gesture & HMI: reliable-short range interaction for operator panels and tools. 


Design Considerations for Reliable Ranging

  • Optics & cover window: ensure low crosstalk geometry; verify thickness/tilt vs. FOV; validate with histogram diagnostics. 
  • Ambient light & targets: test across reflectance and lux extremes; use confidence metrics for gating. 
  • Data path: stream raw histograms over SPI/I3C for AI/SLAM pipelines where needed. 

 

Quick Specs Overview

  • Zones: Up to 48×32 (1,536)
  • FOV: approx. 80° diagonal
  • Range: 10 mm to ~11 m
  • Resolution: 0.25 mm
  • Multi object detection: Supported
  • Temperature: –40°C to +85°C
  • Interfaces: I³C/I²C, SPI
  • Size: 5.7 × 2.9 × 1.5 mm

For full electrical/algorithm details, consult the TMF8829 - Datasheet.

 

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EBV - NPI - ams OSRAM - TMF8829 dToF (GBL)

ams OSRAM

TMF8829 dToF

High-resolution configurable multi-zone dToF sensor is very compact footprint. Featuring a wide FoV, this fully integrated dToF sensor combines a multi VCSEL emitter topology along with a SPAD array, TDCs, embedded processing and optical filters.

EBV - NPI - ams OSRAM - TMF8829_EVM_EB_Shield (GBL)

ams OSRAM

TMF8829_EVM_EB_Shield Evaluation Kit

This board features a small breakaway section which includes the TMF8829 device, the board also features a USB interface to allow direct connection to the evaluation GUI.