AMD Kria™ K24 SOM
The K24 SOM features an exclusive, custom-built XCK24 SoC based on the AMD Zynq™ UltraScale+™ MPSoC architecture that has been configured for enhanced acceleration of motor control and DSP applications.
Area | Parameter | K24 |
---|---|---|
Form Factor | Dimensions (with thermal enclosure) | 60 mm x 42 mm x 11 mm |
Processor Unit & Acceleration | Application Processor | Quad-core Arm® Cortex®-A53 MPCore™ at 1.33 GHz |
Real-Time Processor | Dual-core Arm Cortex-R5F MPCore at 553MHz | |
Graphics Processing Unit | Arm Mali™-400 MP2 at 600 MHz | |
Deep Learning Processor Unit (DPU) | INT8 (852 GOPs with B2304 DPU) | |
Trusted Platform Module (TPM) | Infineon 2.0 | |
Memory | On-Chip* | 9.4 Mb on-chip SRAM |
On-SOM | 2 GB, 32-bit LPDDR4 @ 1066 Mbps w/ ECC configuration** and 32 GB eMMC | |
Connectivity | High-Speed PS Connectivity (GTR) | PCIe® Gen2 x4, 2x USB3.0, SATA 3.1, DisplayPort, 4x tri-mode gigabit Ethernet |
General PS Connectivity (MIO) | 2x USB 2.0, 2x SD/SDIO, 2x UART, 2x CAN 2.0B, 2x I2C, 2x SPI, 4x 32b GPIO | |
Transceivers | GTR 6 Gbps Transceivers | 4 |
I/O Count | PS MIO (1.8V) | 49 |
PL High-density (HD) I/O (3.3V) | 23 | |
PL High-performance (HP) I/O (1.8V) | 56 | |
Programmable Logic | System Logic Cells (K) | 154 |
DSP Slices | 360 | |
Power & Thermal | Typical Power | 5W |
Maximum Power*** | 10W | |
Thermal Interface | Passive (clamshell thermal plates) | |
Speed and Temp Grade | Commercial | -2 speed grade, low voltage and 0 to 85°C temperature range |
Industrial | -2 speed grade, low voltage and –40 to 100°C temperature range |
*On-chip memory (Mb) = max. distributed RAM + total block RAM + UltraRAM
**K24 I-grade only supports ECC memory
***Estimated and subject to change based on actual hardware evaluation