More Kelvin source CoolMOS™ SJ MOSFETs
With CoolMOS™ SJ MOSFET products, Infineon is setting new standards for energy efficiency, power density and ease of use, boasting figures of merit in terms of conduction, switching and driving losses.
The broadest Silicon based superjunction MOSFET portfolio on the market impresses with wide RDS(on) granularity, best-in-class RDS(on) / package, highest efficiency with an optimized price/performance ratio and low EOSS, Qg.
CoolMOS™ 7 family – characteristics and use in high/low power applications
| CoolMOS™ series | Characteristics | In applications | |
|---|---|---|---|
| Price/Performance | 600 V P7 | Price/Performance technology with perfect balance between highest efficiency and ease-of-use | Hard and soft switching topologies for high and low power applications |
| Fast body diodes series | 600 V CFD7 | Successor to CFD2 offering improved efficiency, best-in-class Qrr and enabling highest power density | Soft switching topologies requiring a fast body diode for high power applications |
| Best-in-Class | 650 V C7 / G7 | Best-in-class RDS(on) / package, for hard switching topologies such as PFC; enabling highest efficiency and highest power density | Best-in-class efficiency in hard switching topologies for high power SMPS applications |
| 600 V C7 / G7 | Best-in-class RDS(on) / package, for hard and soft switching topologies such as PFC and high-end LLC; enabling highest efficiency and highest power density | Best-in-class efficiency in hard and soft switching topologies for high power SMPS applications |
- TO-247 4-pin with asymmetric leads
- ThinPAK 8x8
- TO-Leadless
- Top-side cooled Double DPAK (DDPAK)
For highest efficiency and controllability in high power SMPS markets
The TO-247 4-pin package with asymmetric leads is an optimized version of the standard TO-247 4-pin, and enables highest efficiency and controllability in the high power SMPS market. The fourth pin acts as a Kelvin source. The main current of the switch is placed outside of the gate loop and the feedback is eliminated.
This leads to less switching losses, especially at high currents. Secondly, the EMI will be reduced due to cleaner waveforms. In addition, the asymmetric leads further improve the ease-of-use in the design-in process. Compared to the standard TO-247 4-pin, the distance between the critical pins has been increased to enable simplified wave soldering and reduced board yield loss.
Enabling significant space savings
With a very small footprint of only 64 mm² (vs. 150 mm² for the D²PAK), and a very low profile with only 1 mm height (vs. 4.4 mm for the D²PAK), the ThinPAK 8x8 leadless SMD package for high voltage MOSFETs is a first choice to decrease system size in power density driven designs. Low parasitic inductance and a separate 4-pin Kelvin source connection offer best efficiency and ease-of-use.
The package is RoHS compliant with halogen free mold compound.
Optimized for high power applications
Combined with the latest CoolMOS™ C7 Gold (G7) technology, the TO-Leadless (TOLL) package is Infineon’s flagship SMD package for high power/high current SMD solutions. Compared to D2PAK 7-pin, TO-Leadless shows 30 percent reduction in footprint, yet offers improved thermal performance. This and the 50 percent height reduction result in a significant advantage whenever highest power density is demanded. Equipped with 4-pin Kelvin source connection and low parasitic inductances, the package offers best efficiency and ease of use.
The package is MSL1 compliant and reflow solderable.
Download Product brief – CoolMOS™ 600 V G7!
Download Product brief – CoolMOS™ 650 V G7!
Innovative top-side cooled SMD solution for high power applications
This is the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. SMD based SMPS designs support fast switching and help to reduce the parasitic inductance associated with long leaded packages such as the common TO-220 package. In today’s SMD based designs, the output power is restricted by the thermal limit of the PCB material because the heat must be dissipated through the board. Thanks to the top-side cooling concept of DDPAK, the thermal decoupling of board and semiconductor is possible, enabling higher power density or improved system lifetime.
Find the right CoolMOS™ superjunction MOSFET that fits your requirements in the table below, and combine it with either the new 1EDN7550 or the new 1EDN8550. You will benefit from higher power density and reduced product development effort at lower cost.
Product portfolio Kelvin source CoolMOS™ SJ MOSFETs
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