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STMicroelectronics ST67W611M1→ST67W611M1A6BTR

Low-power Wi-Fi 6 & Bluetooth LE combo coprocessor module

STMicroelectronics ST67W611M1→ST67W611M1A6BTR product image

Powered by Qualcomm high‑performance 1 × 1 2.4 GHz Wi‑Fi 6 and Bluetooth 5.4 modem, the STMicroelectronics ST67W611M1 LGA module is purposely designed to pack processing capabilities, Wi-Fi and Bluetooth LE combo connectivity, and on‑module memory into a single 32‑pin LGA form factor.

ST67W611M1 operates as an IoT connectivity transceiver, with an external STM32 host MCU running applications.

ST67W611M1 integrates:

  • A PCB antenna (version -B), a RF connector (version-U) for external antenna, or version with a dedicated RF pin typically for support of multi-antenna with external RF switch
  • 4 MB NOR flash
  • 40 MHz high-precision quartz
  • SMPS functionality
  • All needed discrete components
  • Data interface through SPI

 

Key features

  • Module content
    • All-in-one Wi‑Fi®/Bluetooth® LE wireless microcontroller
    • Embedded 40 MHz high-precision crystal
    • All RF components for transmission and reception matching network, including antenna filter
    • Three variants: embedded antenna (-B version), RF connector (-U version), RF pin (-P version)
  • Standard
    • IEEE 802.11b/g/n/ax
    • Bluetooth® LE 5.4
    • Regulatory certifications: CE/RED, UKCA, FCC, IC, JRF/ARIB, ACMA/RSM, RCM, BIS/WPC, NBTC, RoHS, REACH
    • Wi-Fi and Bluetooth LE can run concurrently dynamically
  • Wi-Fi
    • Wi-Fi 6, 2.4 GHz RF transceiver
    • Wi-Fi 20/40 MHz bandwidth, 1T1R
    • Wi-Fi security WPS/WEP/WPA/WPA2/WPA3
    • STA, SoftAP, concurrent STA + SoftAP
    • Maximum Tx power (11b 1 Mbps): 21 dBm
    • Tx power (HE40 and MCS9): 16 dBm
    • Rx sensitivity (HE40 and MCS9): -67 dBm
    • Application throughput up to 17 Mbps (TCP)
    • LDPC, STBC, beamforming, DL/UL OFDMA, MU-MIMO, target wake time (TWT), spatial reuse (SR), dual carrier modulation (DCM), extended range (ER)
    • A-MPDU, A-MSDU, immediate block ACK, fragmentation, and defragmentation
  • Bluetooth® LE
    • Maximum Tx power: + 10 dBm
    • Rx sensitivity
    • Bluetooth® LE (2 Mbps): -96.5 dBm
    • Bluetooth® LE (1 Mbps): -99 dBm
  • System peripherals
    • SPI
    • UART
    • Security
    • PSA Level 1 certified
    • Security system encryption engine
    • Secure services: Secure boot and FOTA (firmware over-the-air)
  • Voltage
    • Input voltage: 3.3 V
    • I/O voltage: 1.8 V/3.3 V
  • Environmental specifications
    • Temperature:
    • Operating: -40°C ~ +85°C
    • Storage: -40°C ~ +125°C
    • Humidity:
    • Relative: < 90% noncondensing
    • Storage: < 90% noncondensing
  • All packages are ECOPACK2 compliant

 

Applications

  • Smart homes:
    • Door lock and door-bells
    • Cameras 
    • Smart hub
  • Industrial IoT:
    • Industrial control IoT hub/gateways
    • Smart utility metering
    • EV chargers
  • Smart appliances:
    • White goods
    • Kitchen appliances
  • Healthcare:
    • Portable patient monitors
    • Handled devices

 

Available tools

X-NUCLEO-67W61M1:

Wi-Fi 6 & Bluetooth LE expansion board for STM32 Nucleo boards based on ST67W611M1 Wi-Fi module

The X-NUCLEO-67W61M1 expansion board provides an affordable and flexible way for users to try out new concepts and build prototypes with the ST67W series ST67W611M1 coprocessor module.

Data brief

 

Videos

STM32 summit ST67W WiFi coprocessor series announcement

ST67W simple to use WiFi/BT module for STM32 designs

 

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