Nexperia Power MOSFET in CCPAK1212

Nexperia’s JEDEC-standard copper-clip CCPAK1212 MOSFET packaging pushes the limits of performance and efficiency. With a compact 12 mm × 12 mm footprint, it offers two cooling options: bottom-side cooled CCPAK1212 and inverted, top-side cooled CCPAK1212i. These packages deliver up to 1.5 kW power ratings, low electrical and thermal resistance, high current density, and best-in-class SOA performance, ensuring superior reliability and efficiency for the high-power demands of next-generation applications.

Key features

• Top- (CCPAK1212i) or bottom-side (CCPAK) cooled options for design flexibility
• High power rating (1.5 kW) in a compact 12 x 12mm package
• Ultra-low R_DS(on) for low I²R conduction losses
• Best-in-class linear mode (SOA), in-rush & surge protection
• Copper-clip technology gives low electrical & thermal resistance
• High performance silicon
• Outstanding board level reliability

Applications

• High-power BLDC motor control and conversion (DC/DC & AC/DC)
• Battery management & protection
• Renewable energy storage
• Hotswap for communication infrastructure
• Battery management systems