Tria Vision AI-KIT 6490

High performance cores on the Vision AI-KIT 6490 (Qualcomm Dragonwing™ QCS6490 Development Kit) include an 8-core Kryo™ 670 CPU, Adreno 643 GPU, Hexagon DSP and 6th gen AI Engine (12 TOPS), Spectra 570L ISP (64MP/30fps capability) and Adreno 633 VPU (4K30/4K60 enc/dec rates), ensure that exceptional concurrent video I/O processing performance is delivered.

A useful subset of the SMARC interfaces are pinned-out on the carrier board, to support four cameras, two displays, five USB interfaces, CAN-FD, Gigabit Ethernet and optional high-speed Wi-Fi networking. The audio subsystem includes two PDM microphones, stereo audio Codec, digital audio interface and analog audio jack I/O.

Integrated TPM and Wi-Fi/BT modules are offered as assembly options of the QCS6490 SMARC compute module. The carrier board has M.2 slots for NVME storage and advanced wireless options. Compact 100 mm x 79 mm carrier board dimensions and mounting hole alignment with similar AI developer boards, enable a drop-in capability with many enclosures.

Qualcomm Linux BSP (Yocto, 6.6 kernel), plus a range of AI/ML and multimedia open-source example applications are provided. Windows 11 IoT Enterprise and Android support will release in 1H25. (Ubuntu Linux for QCS6490 may at later date be supported.)

Key features

• 4x Arm Cortex-A78 (@ up to 2.7 GHz) plus 4x Arm Cortex-A55 (@ 1.9 GHz)
• GPU: Adreno 643 (@ 812 MHz)
•  ISP: Spectra 570L (up to 5 concurrent cameras)
• 8GB LPDDR5 SDRAM, 64GB UFS Flash Memory
• 2x USB 3.1 (2L), 3x USB 2.0 interfaces • 2x PCIe Gen3 (1L), 1x PCIe Gen3 (2L) interface
• 2x 1 Gigabit Ethernet interfaces • optional - Wi-Fi 6 / BT 5 (assembled on SMARC Module)
• TPM module (SMARC module assembly option) • HW Key manager, ECC, Secure boot, Crypto

Applications

• Service & Industrial robots
• Multi-camera security systems with recognition
• Smart city, smart camera systems
• Food services POS equipment
• Drone/UAV/other mobile Vision-AI Edge compute applications