Renesas RA8D2

The Renesas RA8D2 group comprises 32-bit single and dual-core graphics-enabled MCUs with 1GHz Arm^® Cortex^®-M85 with Helium™ Vector Extensions and 250MHz Cortex-M33 cores. These MCUs deliver ultra-high performance of over 7300 CoreMark and superior graphics capabilities that enable high-resolution TFT-LCD displays up to WXGA, and vision AI applications. Integrating the high-performance cores with large on-chip memory, multiple high-throughput memory interfaces, and a rich set of graphics peripherals – a high-resolution LCD controller with parallel RGB and MIPI DSI interfaces, 2D drawing engine, 16-bit parallel CEU, and MIPI CSI-2 camera interfaces – the RA8D2 MCUs address the needs of demanding graphics/HMI and AI applications. Built on the advanced 22nm ULL TSMC process, these devices offer significantly lower active currents and have several low-power features developed to reduce the overall power consumption, while still providing high performance. The RA8D2 MCUs are available in 224, 289, and 303 BGA packages. Secure Element-like functionality is built-in with new cryptographic security IP, secure boot, immutable storage, and tamper protection, enabling truly secure consumer/IoT applications.

Key features

• 1GHz Arm^® Cortex^®-M85 w/ Helium (6.39 CM/MHz) + 250 MHz Cortex^®-M33
• 8MB/4MB Flash, 1MB/512KB MRAM and 2MB SRAM
• TCM (256KB for CM85 + 128KB for CM33), 64KB I/D Caches
• GLCDC w/ RGB i/f, 2D Graphics engine, MIPI-DSI/CSI2, CEU camera interface
• Advanced security; 224-pin and 289-pin BGA packages
• 16-bit A/D converter, 12-bit D/A converter, temperature sensor, high speed comparators
• Advanced PWM Timers, Gigabit Ethernet MAC w/ TSN/DLR support, 2 port TSN Switch
• USB 2.0 FS, CAN FD, PDM, I2S, I2C/I3C, OSPI, Ext. Memory Bus

Applications

• Industrial automation
• Consumer
• Home and building automation
• Medical
• Office automation