Murata DualBand Wi-Fi 6 + Thread + LE Module
Wi-Fi 6 Module supporting Wi-Fi 6 DualBand, Thread and LE 5.4 based on IW610G chipset from NXP
Murata's Type 2LL Module is a small sized LGA Wireless Connectivity Module in an 8.8mm * 7.7mm * 1.3mm max Shielded Resin Mould package. This Module incorporates the IW610G IC, primary Crystal and RF Front End components. The Module supports Wi-Fi 6 DualBand Operation (IEEE 802.11 a/b/g/n/ac/ax) with 20MHz channel b/w (MCS9), IEEE 802.15.4 Thread and Bluetooth Low Energy 5.4. External interfaces to the Host Processor are SDIO (Wi-Fi), SPI (Thread) and UART (BLE) with option for USB interface for Wi-Fi and BLE. This part requires an external Host Processor and is supported for use with i.MX Application Processor+Linux.
Evaluation Board : EAR00500 from Embedded Artists
Key features
- Supports IEEE 802.11a/b/g/n/ac/ax specification: dual band 2.4GHz and 5GHz Wi-Fi 6
- SISO with 20MHz channels and up to MCS9 data rates 114.7Mbps
- Supports Bluetooth specification version 5.4 (LE) and supports IEEE 802.15.4
- WLAN interface: SDIO 3.0
- 802.15.4 interface: SPI
- Bluetooth interface: HCI UART and PCM-SYNC for BLE audio (PCM over UART)
- Temperature range from -40 to 85°C
- Dimension is 8.8 x 7.7 x 1.3mm
- NXP EdgeLock™ security technology
Applications
- Smart home and home automation
- Smart appliance
- IoT Sensor nodes
- Gateway
- EV Charging
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