Infineon CoolSiC™ MOSFET G2 1400 V in TO-247PLUS-4 Reflow Package

The CoolSiC™ MOSFET G2 1400 V in a TO-247PLUS-4 Reflow package is  ideal for high-output power applications such as EV charging, ESS, CAV and other applications. 

The CoolSiC™ MOSFET G2 1400 V technology is a cutting-edge technology offering improved thermal performance, increased power density and enhanced reliability. The package enables reflow soldering assembly (3x reflow soldering possible) enabling lower thermal resistance and supports high peak currents. 

Key features

• Package backside suitable for reflow soldering at 260°C, three times
• Overload operation up to T_vj = 200°C
• Benchmark gate threshold voltage, V_GS(th) = 4.2 V
• Very low switching losses
• Short circuit withstand time 2 µs
• Robust against parasitic turn on, 0 V turn-off gate voltage can be applied
• Robust body diode for hard commutation
• XT interconnection technology for best-in-class thermal performance
• Wide power pins (2 mm) for high current capability
• Resistive weldable pins for direct busbar connections
• TO-247PLUS package with high creepage distance 10.8 mm and CTI ≥ 600 V

Applications

• Commercial, construction and agricultural vehicles (CAV)
• EV Charging
• Energy storage systems (ESS)
• Online UPS / Industrial UPS
• String inverter
• General purpose drives (GPD)