Toshiba Electronics Europe XPH8R316MC and XPH13016MC

Toshiba's XPH8R316MC and XPH13016MC are two -60V P-channel MOSFETs, qualified to meet AEC-Q101.

They are housed in an SOP Advance (WF) package - a surface mount style with a wettable flank terminal structure. This facilitates automated optical inspection of the solder joints – key to reliability in harsh automotive environments.

An additional advantage is the copper connectivity within the package that reduces package resistance, improves efficiency and reduces heat build-up. The R_DS(ON) values are reduced compared to the former products and contribute significantly to reducing power consumption within automotive applications.

Key features

• 8.3mΩ R_DS(ON) of XPH8R316MC is approx. 25% lower than existing TPCA8123
• 12.9mΩ R_DS(ON) of XPH13016MC is approx. 49% lower than existing TPCA8125
• XPH8R316MC rated for -90A I_D, XPH13016MC rated for -60A I_D
• Small size SMD type, 5×6 mm2 package

Additional features

Advantages

• AEC-Q101 qualification
• Operation at T_ch up to 175ºC
• Low energy loss

Benefits

• SOP Advance wettable flank package for AOI inspection of solder joints
• Reduced power consumption in automotive applications
• Low loss enables smaller and more compact designs, thus reducing set cost

Applications

• Automotive relays
• Automotive high side switches
• Motor drives, fans & pumps
• Reverse polarity protection