Murata LBEE5WV2GF-001

Murata's Type 2GF Module is a small sized LGA Wireless Connectivity Module in an 10.0mm * 7.2mm * 1.5mm max Shielded Resin Mould package. This Module incorporates the CYW43022 IC, primary Crystal and RF Front End Components. The Module is supporting Wi-Fi 5 Operation (802.11a/b/g/n/ac) and Bluetooth 5.3 (BR / EDR / LE) and external interfaces to the Host Processor are SDIO and UART respectively. This part requires external Host Processor and support is with i.MX Application Processor and Linux. Evaluation Board : EAR00497 from Embedded Artists is in late stages of development. With the CYW43022 chipset this Module supports lower power consumption for Wi-Fi, making it better suited for battery operated products and applications. The part is in the same Module package as the older Type 1LV (CYW43012) Module with the same pin assignments as a "next generation" device.

Key features

• Wi-Fi 5 Dual Band (802.11a/b/g/n/ac)
• Bluetooth 5.3 for BR / EDR and LE
• Integrated Front End components and main X'Tal
• 50Ohm Antenna port
• Regulatory Certification for North America based on Reference Antenna
• Contains CYW43022 Chipset from Infineon
• Same Module package as the Type 1LV
• Shielded Resin Mould package with 106 pads
• Interface to Host as SDIO (Wi-Fi) and UART (Bluetooth)

Applications

• Sensors
• Smart home
• Battery operated devices
• Electronic Point of Sale