Infineon Technologies XHP™ 2.XT
IGBT5
High power traction and wind applications require high reliability and robustness, combined with system availability and long lifetime. XHP™ 2 modules with IGBT5 and .XT meet those requirements: IGBT5 allows higher power density, whereas the .XT interconnection technology extends the lifetime by increased thermal and power cycling capabilities.
Key features
- Optimized for low inductive design
- Extended operation temperature
- TVjop= 175°C
- Output current increased by more than 25% compared to IGBT4
Additional features
- Copper bonds for high current carrying capabilities
- Sintering of chips for highest power cycling capabilities
- Total losses reduced by up to 20%
- Package with CTI > 400
Applications
- Wind
- Traction
- Solar
- Energy storage
- Motor control and drives
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