Infineon Technologies CoolSiC™ MOSFET
CoolSiC™ Power module portfolio extension
The EasyPACK™ and EasyDUAL™ 1B and 2B in various topologies with CoolSiC™ MOSFET enhanced generation 1 are suitable for 1200 V applications and come with PressFIT contact technology and NTC. They are also available with AlN/Al2O3 substrates and thermal interface material (TIM).
Key features
- Leading edge WBG material
- Very low stray inductance
- Enlarged gate drive voltage window
- PressFIT pins
Additional features
No more features
Applications
- EV Charging
- Energy Storage Systems
- Solar
- UPS
Related partsBuy online and see datasheets: |
Do you have a Question?
Contact EBV
If you need any assistance, please click below to find your closest EBV sales office.
Links and documents |