Infineon Technologies AIROC™ CYW20829

Infineon’s AIROC™ CYW20829 Bluetooth^® LE MCU is a v5.4 core spec-ready device that delivers the optimal combination of compute and RF performance, energy efficiency, I/O options and security to enable feature-rich, innovative Bluetooth^® solutions for a wide range of applications.

The CYW20829 integrates dual Arm^® Cortex^®-M33 cores, a powerful highly efficient Bluetooth^® LE radio with best-in-class RF link budget, application SRAM, a rich set of interfaces and peripherals including a SMIF with XIP capability for external flash, and it features support for secure boot, a secure execution environment, and eFuse for custom keys.

Key features

• Full feature Bluetooth^® LE 5.4 support
• Up to 96 MHz ARM^® Cortex^® M33 application core
• 256 KB SRAM
• Up to 48 MHz ARM^® Cortex^® M33 Bluetooth^® subsystem core

Additional features

• 96 KB SRAM
• 48 MHz Quad SPI SMIF with XIP, on-the-fly encryption and 32 kB cache
• Secure boot & crypto HW engine
• TX power: up to +10 dBm
• RX sensitivity: -106 dBm (coded, S=8)
• 1.7 to 3.6 V supply voltage range
• 32 programmable GPIO
• CAN-FD and LIN support
• -30 to 85°C operating temp. range
• 6 x 6 QFN-56

Applications

• Industrial
• Asset tracking, solar farms, automation
• Smart Home
• Home automation, sensor nodes, remote controls
• Health
• Medical patches, wearable monitors
• Gaming
• AR/VR controllers and accessories
• PC Accessories
• Mouse, keyboards, ULL HID