Infineon CIPOS™ Maxi 1200 V IPM IM12BxxxC1 series

High-performance CIPOS™ Maxi transfer molded IPM IM12BxxxC1 series is based on the new 1200 V TRENCHSTOP™ IGBT7 and rapid diode Emcon 7 technology. Thanks to the latest micro-pattern trench design, it delivers ex- ceptional control and performance. This leads to substantial loss reduction, heightened efficiency, and increased power density. The portfolio includes variants ranging from 10 A to 20 A, offered three new products: IM12B10CC1, IM12B15CC1 and IM12B20EC1. The series integrates 6 TRENCHSTOP™ IGBT7 with an optimized 1200 V 6-channel SOI gate driver to increase reliability, provide excellent protection and optimize PCB size and system costs. The smallest and most compact package in the 1200 V class, this IPM combines a power rating in excess of 4 kW with exceptional power density, reliability and performance. It offers excellent protections such as under- voltage lockout on all channels, all switches turnoff during protection, cross- conduction prevention, over-current protection, temperature monitoring.

Key features

• Fully isolated dual inline molded module with DCB
• 1200 V TRENCHSTOP™ IGBT7
• Rugged 1200 V SOI gate driver technology
• Integrated bootstrap functionality
• Overcurrent shutdown
• Undervoltage lockout on all channels
• Turn-off of all six switches during protection
• Cross-conduction prevention
• Allowable negative V_S potential up to -11 V for signal transmission at V_BS=15 V
• Low-side emitter pins accessible

Applications

• Fans
• Pumps
• Outdoor fan for HVAC
• Low-power motor drives