Vishay SISD5300DN 30 V N-Ch MOSFET

Occupying the same footprint as the PowerPAK 1212-has a 35 % improvement over previous-generation devices, which translates into reduced conduction and switching losses to save energy in power conversion applications. PowerPAK1212-F source flip technology reverses the usual proportions of the ground and source pads, extending the area of the ground pad to provide a more efficient thermal dissipation path and thus promoting cooler operation.

Key features

• TrenchFET^® Gen V power MOSFET
• Very low R_DS x Q_g figure-of-merit (FOM)
• Source flip technology, enhance thermal performance
• Simplifies parallelization of multiple devices on a single-layer PCB

Additional features

• 30 V N-Channel MOSFET with source flip technology delivers best in class R_DS(ON) down to 0.71 mΩ in PowerPAK^® 1212-F
• Very low R_DS x Q_g figure-of-merit (FOM)
• Source flip technology, enhance thermal performance
• Occupyies the same footprint as the PowerPAK 1212-8S, 3.3 mm x 3.3 mm
• Offers 18 % lower on-resistance to increase power density than PowerPAK 1212-8S
• Source flip technology reduces thermal resistance by 63 °C/W to 56 °C/W.
• The SiSD5300DN’s FOM has a 35 % improvement over previous-generation devices, which translates into reduced conduction and switching losses to save energy in power conversion applications.
• PowerPAK1212-F source flip technology reverses the usual proportions of the ground and source pads, extending the area of the ground pad to provide a more efficient thermal dissipation path and thus promoting cooler operation
• The PowerPAK 1212-F minimizes the extent of the switching area, which helps to reduce the impact of trace noise
• Simplifies parallelization of multiple devices on a single-layer PCB.

Applications

• The source flip PowerPAK1212-F package, especially suitable for applications:
  • Secondary rectification,
  • Active clamp battery management systems (BMS),
  • Buck and BLDC converters, OR-ing FETs,
  • Motor drives, and load switches.
     
• Typical end products include welding equipment,
• And power tools; servers, edge devices,
• Supercomputers, and tablets;
• Lawnmowers and cleaning robots;
• And radio base stations.