Infineon Technologies XHP™ 4.5 kV dual IGBT module

With TRENCHSTOP™ IGBT4

These low inductive XHP™ 4.5 kV modules with AlSiC baseplate and AIN substrate are perfect for 3-level applications to significantly improve the efficiency of design in drives or transportation by saving at least 25% on system cost level and size. Hereby a 3300 V DC MVD system can be downsized without losing performance and reliability.

 

Key features

• High DC stability
• High short-circuit capability
• High surge current capability
• Unbeatable robustness

 

Additional features

• T_vjop= 150°C
• AlSiC base plate for increased CTI > 600
• Fire & smoke EN45545 R22, R23, R24: HL2
   

Benefits

• Low inductive module
• Enables clean electrical design
• Enables clean mechanical design
• Easy set-up of 3-level NPC1 topology
• Easy set-up of parallel configuration
• Better scalability, on smaller steps
• Better match to various power levels
• Smoother logistics handling and stocking
• Enables downsizing on system level

 

Applications

• Commercial, construction and agricultural vehicles (CAV)
• Motor control and drives
• Traction

ebv content library/npi/2023/infineon-technologies-xhp-4-5-kv-dual-igbt-module Infineon Technologies XHP™ 4.5 kV dual IGBT module | EBV Elektronik