ams OSRAM OSLON® submount PL gen 3

The OSLON^® Submount PL is a versatile solution that can meet various output and adaptability requirements in different ambient conditions. It provides a uniform light pattern, thermal stability, and impressive brightness.

With its top contact LED design, the OSLON^® Submount PL allows for direct mounting onto a heatsink, resulting in significant cost reduction for the PCB.

The OSLON^® Submount PL is capable of meeting a wide range of output and adaptability requirements, while also offering a uniform light pattern, thermal stability, and high brightness.

Key features

• Two different LEA sizes (1030μm)² and (1150μm)² available
• New FWL single color binning
• Direct attach of whole LED backside on heatsink
• Compatible with other submounts

Additional features

• Package: compact lightsource in multi chip on board technology
• Chip technology: UX:3
• Typ. Radiation: 120° (Lambertian emitter)
• Color: C_x = 0.325, C_y = 0.334 acc. to CIE 1931 (● white)
• Corrosion Robustness Class: 3A
• Qualifications: AEC-Q102 Qualified
• ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
• Color over angle: Better than passus 3.7.2.1 of supplement proposal 7 to ECE reg. 128

Applications

• Standard high beam / low beam (“Halogen replacement”)
• Dynamic forward lighting
• Static forward lighting
• Heatsink-less headlamp
• Standard modules