Nexperia auto DFN packaging with SWF

Nexperia’s AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight while ensuring the performance and efficiency of these components – especially at high temperatures. Automotive DFN (Discretes Flat no-leads) options exist across the full portfolio of diodes, bipolar transistors, and MOSFETs.

More than 460 different high-volume devices are available in the recently released DFN1412D-3, DFN1110D-3, and DFN1006BD-2 package. DFN devices can measure as small as 0.6 mm² offering a PCB space-saving of up to 90 % when compared to current SOT23 devices.

Key features

• Space efficient designs (Ultra-compact footprint, very low height)
• High thermal performance
• High power dissipation
• Low operating temperature extending the total system reliability

Additional features

• Space efficient designs (Ultra-compact footprint, very low height)
• High thermal performance
• High power dissipation (P_tot)
• Tj = 175 °C capability
• Side-wettable flanks for easy automated optical inspection (AOI)
• Robust solder joints, high reliability

Applications

• Load switches in power management functions
• Body control units: doors, window lift, seat control
• Infotainment systems: car radio, navigation
• Safety and control systems: air bag, LED lighting, et al.