Infineon Technologies XENSIV™ MEMS microphone

The IM72D128V01 is an ultra-high performance digital microphone designed for applications which require a very high SNR (low self-noise) and low distortions (high AOP). This microphone is based on Infineon’s new Sealed Dual Membrane MEMS technology which delivers high ingress protection (IP57) at a microphone level. The flat frequency response (20 Hz low-frequency roll-off) and tight manufacturing tolerance improve performance of multi-microphone (array) applications. Different power modes can be selected in order to suit specific clock frequency and current consumption requirements.

Key features

• Ultra-low self-noise / ultra-high SNR (72 dB)
• Selectable power modes for battery critical applications (980/280 µA)
• Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
• Ultra-high dynamic range and high acoustic overload point (AOP) of 128 dB SPL

Additional features

• Very tight part-to-part phase and sensitivity matching (± 1 dB)
• Flat frequency response with a very low LFRO (low frequency roll-off) of 20 Hz
• Very low group delay (7 µs @ 1 kHz)
• Crystal clear audio pick up of the quietest and the loudest sounds
• High ingress protection (IP57) at a microphone level
• Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

Applications

• ANC headphones
• Conference systems
• Smart speaker
• Laptops & tablets
• Surveillance
• Cameras

Available tools

Evaluation Board KITIM72D128V01FLEXTOBO1

• Five XENSIV™ MEMS microphones mounted on flex board and one adapter board. The flex evaluation kits allow simple and easy evaluation of XENSIV™ MEMS microphones. One microphone of the re-spective type is mounted on each flex board. A flex board can be easily connected to an audio testing setup with the included adapter board via a 6-position ZIF connector. Each kit includes five flex boards and one adapter board.