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Infineon Technologies XDP™ digital power XDPS2221

PFC + hybrid flyback combo IC

Infineon Technologies XDP™ digital power XDPS2221 product image

Driving giGaNtic performance in USB-C adapters and chargers: The novel XDP™ digital power XDPS2221 is a highly integrated control IC combining an AC-DC PFC controller with a DC-DC hybrid flyback controller in one single package.

It enables optimized system performance through the combined operation of the two stages and brings ultimate efficiency in conjunction with GaN-based devices.

 

Key features

  • IEC62368-1 certified active X-cap discharge function
  • High-performance multi-mode PFC with critical conduction mode operation
  • High efficiency multi-mode hybrid-flyback topology with adaptive resonant period
  • DSO-14 (150-mil) package

 

Additional features

  • Supports USB-PD standard V3.1 extended power range (EPR) with wide output voltage up to 28 V (36 V / 48 V to be covered by XDPS2222 available in Q2/2023)
  • Highly integrated combo controller for the PFC and hybrid flyback topology, including a 600 V start-up cell with X-cap discharge functionalit
  • Class-leading efficiency across various line/load conditions
  • Ultra-high power density and switching frequency
  • Up to 50% transformer size reduction compared to flyback topologies
  • Low BOM cost and count
  • Low no-load input standby power performance
  • Easily configurable via digital software

 

Applications

  • Adapters and chargers with ultra-high power density
  • Adapters and chargers with extended power range (EPR)

 

Available tools

140 W reference board for ultra-high power density in USB-C chargers with EPR and adapters

The reference board REF_XDPS2221_140W1 was developed for USB-PD applications with a wide input range and output voltage from 5 V to 28 V. The nominal output power of this design is 140 W.

It features the industry’s first PFC + hybrid flyback combo controller XDP™ digital power XDPS2221, CoolGaN™ 600 V GIT HEMTs (IGLD60R190D1) as the main switch, and on the secondary side the BSC040N10NS5 OptiMOS™ 5 N-channel MOSFET serving as the SR switch. The P-channel HEXFET™ power MOSFET IRF7240 is the safety switch and the EZ-PD™ CCG3PA was implemented for PD control.

The board has a dimension of 109.5 mm x 38.5 mm x 24 mm and a power density of 22.67 W/in³. Two layers PCBs are used for the whole system, which results in low system cost. The board fulfills the efficiency requirement from DOE VI and CoC Tier 2. The 5 V standby input power is below 75 mW.

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