Infineon Technologies PrimePACK™ 2300 V half-bridge

The new PrimePACK™ 2300 V IGBT modules support the trend of 1500 VDC designs for central solar inverters. It features a high robustness against cosmic radiation for this operating voltage and 175°C overload junction operating temperature to support failure modes like LVRT.

In addition, the module enables higher power density compared to IGBT4 solutions, which leads to a reduction of € / W on system level.

In combination with the 1200 V Common Collector IGBT module an NPC2 topology can be realized, which compared to a 1200 V NPC1 topology results in a reduction of stray inductance, faster switching and 37% higher power in the same footprint.

Key features

• PrimePACK™ 3+ housing
• TRENCHSTOP™ IGBT7 chip generation
• 175° C T_vjop during overload
• Module current rating of 2400 A at 1200 V and 1800 A at 2300 V

Additional features

• Module layout optimized for low stray inductance
• Low cost and high-power density for 1500VDC applications
• Up to 1.8 MW output with 3-level NPC2 topology, forced aircooled
• Low stray inductive design enables faster switching speeds and lower losses
• Cosmic ray robustness allows for continuous operation at 1500VDC
• Module can compensate grid failures like LVRT
• Reduced effort in electrical, thermal and system design

Applications

• Solar central
• Energy storage systems
• Wind
• Hydrogen