New Product Introduction

Infineon Technologies AIROC™ CYW20819

Bluetooth® & Bluetooth® LE system on chip

Infineon Technologies AIROC™ CYW20819 product image

The AIROC™ CYW20819 dual mode Bluetooth® SoC builds upon the market proven AIROC™ Bluetooth® and Bluetooth® LE family of SoCs. The CYW20819 enables ultra low-power high performance wireless connectivity for a variety of IoT applications. The CYW20819 SoC provides reliable Bluetooth® and Bluetooth® LE connectivity and is 5.2 core spec compliant. With an integrated Arm® Cortex®-M4 processor, the CYW20819 SoC offers high performance compute suitable for a variety of applications. The CYW20819 SoC is highly integrated with multiple serial interfaces, PWMs, and more. 

 

Key features

  • Core spec 5.2 complaint with 96-MHz ARM® Cortex®-M4 MCU and LE-2 Mbps support
  • Programmable Tx power up to 4.5 dBm and -95.0 dBm LE Rx sensitivity
  • Infineon branded modules are certified with global regulatory bodies
  • Integrated flash, analog and digital components allowing easy external component interface

 

Additional features

  • Reliable Bluetooth® Connectivity
  • Reduction in dropped packets during transmission improving customer experience
  • Reduced development costs and faster time to market with fully certified modules
  • Reduced BOM and faster time to develop with external sensors

 

Applications

  • Smart home automation
  • Smart Building
  • Factory automation
  • Industrial lighting
  • Industrial robotics
  • Asset tracking
  • Medical / Healthcare

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