Infineon Technologies 56Mbit & 512Mbit HYPERRAM™

HYPERRAM™ is a high-speed, low-pin-count, low-power self-refresh Dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory for scratchpad or buffering purposes.

HYPERRAM™ 2.0 supports HYPERBUS™ and Octal xSPI interfaces that are compliant with the JEDEC xSPI standard. HYPERRAM™ 2.0 offers a read/write bandwidth of up to 400 MBps in DDR mode. It comes in the industry's smallest 6 mm x 8 mm 24-ball BGA package and offers an extended operating temperature range (-40C to +105C). Industrial, Ext-Industrial, Auto-Grade 3, Auto-Grade 2 and Auto-Grade 1 temperature grades are available and it is AEC-Q100 qualified.

Key features

• Operating voltage range: 1.7–2.0 V
• HYPERBUS™ and Octal xSPI interfaces compliant with JEDEC xSPI standard
• Double data rate (DDR) read/write bandwidth: 400 MBps
• Configurable burst modes (Linear burst, Wrapped length burst and Hybrid burst)

Additional features

• Deep Power Down: 10 μA (max) and Hybrid Deep Sleep: 25 µA (typ) at 85 ºC [256Mb]
• Active Current: 25 mA (max) at 85 ºC [256Mb]
• Partial Memory Array Refresh feature to optimize battery performance
• Industrial grade (-40 ºC to +85 ºC) and Extended-industrial grade (-40ºC to +105 ºC)
• Low pin count – Ensures lesser IOs are utilized on the MCU or FPGA for interfacing
• Small package – Ensures lower footprint on board
• Low power – Suitable for battery operated applications

Applications

• Wearable devices
• Communication devices and gateways
• IOT Modules