ams OSRAM OSLON® compact PL Gen 3

The new OSLON^® Compact PL family members (Gen3) - KW CELNM3.TK & KW2 CFLNM3.TK come with higher brightness due to increased LES and two solder pads for better solder stability.

The OSLON^® Compact PL family comprises single as well as multichip configurations for low/ high beam application with best in class luminance performance and different solder pad designs. Its compact size enables narrow positioning especially beneficial for ADB Headlamp solutions. The products combine the latest UX:3 chip technology with a homogeneous light emitting area giving highest flux performance for easier optical design and thermal management.

Key features

• Latest chip technology providing typ. 455lm high luminance performance up to 132cd/mm²
• Distance from converter platelet to package edge only 235μm (l/r sides) and 174μm (top)
• 3 pad design allowing ideal thermal management in application
• Footprint compatible with OSLON^® Boost HM

Additional features

• Qualifications: AEC-Q102 qualified
• ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
• Color over angle: Better than passus 3.7.2.1 of supplement proposal 7 to ECE reg. 128
• Color: Cx = 0.316, Cy = 0.330 acc. to CIE 1931 (white)
• Package: Ceramic package
• Chip technology: UX:3
• Typ. Radiation: 120° (Lambertian emitter)
• Corrosion robustness class: 3A

Applications

• Dynamic forward lighting
• Static forward lighting
• Daytime running light
• Standard low and high beam
• Adaptive driving beam