ams OSRAM KW CWLPM3.TK

The new OSLON^® Compact PL family member comes with higher brightness due to increased LES and two solder pads for better solder stability.

The OSLON^® Compact PL family comprises single as well as multichip configurations for low/ high beam application with best in class luminance performance and different solder pad designs. Its compact size enables narrow positioning especially beneficial for ADB Headlamp solutions. The products combine the latest UX:3 chip technology with a homogeneous light emitting area giving highest flux performance for easier optical design and thermal management.

Key features

• Latest chip technology providing typ. 410lm @ 1A per mm²
• Color over angle: Better than passus 3.7.2.1 of supplement proposal 7 to ECE reg. 128
• ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
• AEC-Q102 Qualified

Additional features

• Additional electrical isolated thermal pad separates thermal management from electrical circuit (3 pad design)
• High luminance performance up to 120 cd/mm²
• Smallest possible distance from converter platelet to package edge with only 235μm (left and right side) and 174μm (top side)
• Package: Ceramic package
• Chip technology: UX:3
• Typ. Radiation: 120° (Lambertian emitter)
• Corrosion Robustness Class: 3A

Applications

• AFS Headlamp Systems
• Adaptive driving beam
• Day time running light
• Lowbeam
• Highbeam
• Turn indicator