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New Product Introduction

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AMD Zynq™ UltraScale+™ ZU1 MPSoC

Cost & Power optimized Zynq™ UltraScale+™ SoC for high-performance edge compute

Introducing the next generation Cost-Optimized Portfolio for ultra-compact, high compute edge applications. The new UltraScale+™ enhancements continue the scalability of AMD’s established cost-optimized portfolio and inherit the industry-leading UltraScale+™ FPGA and MPSoC technologies.

With new form factors that are 70 percent smaller than traditional Xilinx chip-scale packaging, the new Artix™ and Zynq™ UltraScale+™ families can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.

Key features

60% less area (than flip-chip packaging) for better thermal & power distribution
40% less static power than ZU2 device, with only 20% less programmable logic
Same Arm Multiprocessing subsystem for portfolio scalability
Highest DSP-to-System Logic Cell ratio for maximum compute and AI offloading

Additional features

New ZU1 device delivers most cost-optimized MPSoC, powered by state-of-the art Arm multi-processing system, DSP compute, and AI acceleration, and connectivity for cost-sensitive Edge & IoT system, including smart machine vision cameras, consumer, and medical devices (including hand-held ultrasound and patient monitors, defibrillators, and more).
Zynq UltraScale+™ devices with InFO packaging deliver Highest Arm processing, AI compute, signal processing, memory bandwidth, and I/O bandwidth per mm2 vs. ASSPs (TI, NXP, and Renesas); Minitiuarize your high end compute applications for more intelligence out of the same form factor.
ZU1 delivers a new low-cost entry point to production proven ZU+ portfolio for edge application vendors, with the same processing system and scalable AI compute, vision processing, and system integration.