Tria MSC C6C-RYZ

The Tria (formerly MSC) C6C-RYZ module is the embedded platform for the AMD Ryzen™ Embedded V1000 and R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements. The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.1/2.0 interfaces complete the compact and power saving module. The MSC C6C-RYZ offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability. The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.

Key features​

• AMD Ryzen™ Embedded V1807B, quad-core Processor (3.35/3.8GHz, 11 GPU CU, 35-54W TDP)
• AMD Ryzen™ Embedded V1756B, quad-core Processor (3.25/3.6GHz, 8 GPU CU, 35-54W TDP)
• AMD Ryzen™ Embedded V1605B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP)
• AMD Ryzen™ Embedded V1404B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP), industrial temperature range
• AMD Ryzen™ Embedded V1202B, dual-core Processor (2.3/3.2GHz, 3 GPU CU, 12-25W TDP)
• AMD Ryzen™ Embedded R1606G, dual-core Processor (2.6/3.5GHz, 3 GPU CU, 12-25W TDP)
• AMD Ryzen™ Embedded R1505G, dual-core Processor (2.4/3.3GHz, 3 GPU CU, 12-25W TDP)
• Up to 32 GB DDR4-3200 SDRAM, dual-channel, optional ECC
• Two SATA 6Gb/s mass storage interfaces
• Three DisplayPort/HDMI/DVI interfaces
• Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
• Up to four independent displays supported
• DirectX 12, OpenGL 4.6, OpenCL 2.1
• Resolution up to 4096 x 2160
• Up to four USB 3.1/2.0 and four USB 2.0 interfaces
• Up to eight PCI Express™ x1 lanes
• PEG configurable up to 1×8 or 2×4
• Trusted Platform Module TPM 2.0
• UEFI Firmware