Nexperia LFPAK56D half-bridge

A series of half-bridge (high side & low side) MOSFETs constructed in the space-saving LFPAK56D package format. Occupying 30% lower PCB area compared to dual MOSFETs for 3 phase motor control topologies due to the removal of PCB tracks whilst permitting simple automated optical inspection (AOI) during production. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug-and-play style solution with exceptional current handling capability.

Key features

• 60% lower parasitic inductance due to internal clip connection
• 30% space saving on PCB compared to LFPAK56D dual
• High performance ID max more than 60 A
• Low thermal resistance

Additional features

• LFPAK56D package with half-bridge configuration
  • Enables reduced PCB layout complexity
• Module shrinkage through reduced component count
• Improved system-level Rth(j-amb) due to optimized package design
• Lower parasitic inductance to support higher efficiency
• Footprint compatibility with LFPAK56D Dual package
• NextpowerS3 technology
• Low power losses, high power density
• Superior avalanche performance
• Repetitive avalanche rated
• LFPAK copper clip packaging provides high robustness and reliability
• Gullwing leads support high manufacturability and Automated Optical Inspection (AOI)

Applications

• Industrial, handheld power tools
• Portable appliance and space constrained applications
• Brushless or brushed DC motor drive
• DC-to-DC systems
• LED lighting