Nexperia DHXQFN package for logic

Nexperia's DHXQFN is the industry's smallest 14, 16, 20, and 24 pins package, offering significant space-saving on PCB. The small footprint of the DHXQFN package enables devices to be placed closer to the bypass capacitor. This can be a significant advantage in designs with limited board space for glue logic parts, and also results in increased performance in high-frequency applications since the traces between logic device and capacitor are shorter.

Key features

• Smallest and thinnest 14, 16, 20 and 24 pins package
• Significant space savings up to 25% on PCB area compare to competitors’ package
• 45% of space saving compare to industry standard DQFN package
• Delivers better performance due to closer placement of supply bypass capacitor

Additional features

• Smallest and thinnest 14, 16, 20, and 24 pins package
• Significant space savings up to 25% on a PCB area compared to competitors' packages (16 pin package as a reference).
• 45% of space-saving compared to the industry standard DQFN package (16 pin package as a reference).
• The small footprint and thinness of the package make it the perfect choice for space-constrained applications.
• Delivers better performance due to closer placement of supply bypass capacitor
• Control plan in place for process, product & package
• RoHS and dark-green compliant

Applications

• Inverters, transceivers, line drivers
• Handset
• Mobile health care
• Consumer products