Infineon Technologies HybridPACK™ Drive CoolSiC™

The HybridPACK™ Drive is a very compact six-pack module, available in two variants with different chip counts 1200 V/400 A (8 chips per switch) and 1200 V/200 A (4 chips per switch), optimized for hybrid and electric vehicles.

The power module implements the new CoolSiC™ Automotive MOSFET 1200 V, which is optimized for electric drive train applications. 

This new product offers an easy upscale from silicon to silicon carbide, with the same package as the IGBT B6 module version.

Key features

• New semiconductor material - Silicon Carbide (SiC)
• Blocking voltage: 1200 V
• Low switching losses
• Low Og and Crss

Additional features

• Low R_DS(ON)
• Tvj op = 150 °C
• Mechanical Features
  • 4.2 kV DC 1sec Insulation
  • High creepage and clearance distances
  • Compact design
  • High power density
  • Direct cooled PinFin base plate
  • High-performance Si3N4 ceramic
  • UL 94 V0 module frame

Additional benefits:

• Compact design
• Directly cooled base plate
• Guiding elements for PCB and cooler assembly
• Integrated NTC temperature sensor
• PressFIT contact technology
• Superior reliability
• RoHS compliant
• AQG-324 qualified

Applications

• Main inverter in Electric vehicles