Infineon Technologies EasyPACK™ automotive IGBT 750V

The EasyPACK™ 2B is a very compact and flexible halfbridge solution, optimized for inverter applications of hybrid and electric vehicles up to 230Arms. The module uses the benchmark EDT2 IGBT generation allowing 750V blocking voltage and IcN of 300A. The chipset has benchmark current density combined with short circuit ruggedness for reliable inverter operation under harsh environmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve system efficiency over a real driving cycle. The EasyPACK™ package is fully qualified for automotive applications and is validated according to AQG 324.

Key features

• Blocking voltage 750 V
• Ic nom 300 A
• Tvj op = 150°C
• Low VCEsat

Additional features

• Low Switching Losses
• Low Inductive Design
• Low Qg and Crss
• 4.2kV DC 1sec Insulation
• High Creepage and Clearance Distances
• PressFIT Contact Technology
• Integrated NTC temperature sensor
• RoHS compliant 120 V on-chip bootstrap diode
• Reduced footprint for PCB design
• Lead-free RoHS compliant package
• Easy system assembly (PressFIT contact technology for solder-less mounting)
• Easy design (Integrated module solution with optimized thermal management)
• High reliability (high short circuit ruggedness, blocking voltage, power cycling capability, creepage and clearance distances)
• Flexibility (half bridge concept for flexible inverter design)
• Fully qualified and validated for automotive (AQG 324)

Applications

• Traction Inverter
• Electric vehicle (EV) drivetrain system
• Commercial, Construction and Agriculture Vehicles