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Infineon Technologies 62 mm module - FF600R12KT4

62 mm power module 1200 V with IGBT4 – FF600R12KT4

Infineon Technologies XENSIV TLE4999C8 product image

The 62 mm power module is a well-established design with an isolated base plate and screw main terminals. The four baseplate mounting holes enable fast, cost-efficient, and easy module assembly. The module housing is optimized for the highest system availability, realized by high thermal cycling capability. It provides a minimum of the service cost and OFF-time losses.

The FF600R12KT4 provides the highest power density in the standard 62mm housing and is equipped with a fast trench IGBT4 chip. It is tailored for drives, UPS, and solar applications.

 

Key features

  • 600 A/1200 V
  • Fast trench IGBT4 chip technology
  • Established 62 mm module design with isolated baseplate
  • Robust standard housing, screw main terminals

 

Additional features

  • Highest power density in standard 62mm package
  • A low stray inductance of 20 nH and symmetrical internal construction
  • Increase in a lifetime by a factor of two compared to IGBT3
  • Increase in power cycling capability by a factor of four compared to IGBT3
  • Optimized design for creepage and clearance distances
  • Tjop (MАX) = 150 °C

 

Applications

  • Motor control and drives
  • Solutions for solar energy systems
  • Uninterruptible power supply (UPS)

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