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New Product Introduction

NPI Body

Infineon Technologies TRENCHSTOP™ advanced isolation

TRENCHSTOP™ Advanced Isolation is able to deliver at least 35% lower thermal resistivity and at least 10% system cost reduction

This new package concept is able to match the highest requirements in terms of performance, design flexibility and ease of handling. By eliminating the need for thermal grease or thermal interface sheets the TRENCHSTOP™ Advanced Isolation is able to deliver at least 35% lower thermal resistivity and at least 10% system cost reduction, helping designers to lower system complexity, development time, and assembling costs.

Key features

Fully isolated package
35% lower R compared to Iso-foil
50% lower R compared to Full-Paks
Low coupling capacitance

Additional features

Reliable electrical insulation:
- 2.500 VRMS at 50/60 Hz, t = 1 min
Lower assembling costs
- No need to use isolation material and thermal grease
- 35% reduction in assembling time compared to standard TO-247 with Iso-foils
Improved reliability:
- 100% tested isolated mounting surface
- Increased yield eliminating misalignments of isolation foils
Decreased heatsink size or Increased power density
- Up to 10°C lower Tc compared to standard TO-247 with isolation material
- Up to 20% Iout increase for higher power output
Decreased EMI filter size & decreased system costs improved reliability
- Complete manufacturing process control
- Easy paralleling