Infineon Technologies HybridPACK™ FF450R08A03P2 module

HybridPACK™ DSC S2 FF450R08A03P2 750 V, 450 A half bridge automotive qualified IGBT module.

The HybridPACK™ DSC S2 is a very compact half bridge module (750 V/450 A) optimized for hybrid and electrical vehicles. This power module combines the benchmark EDT2 IGBT generation with Infineon’s Double Sided Cooling package (DSC), on-chip temperature and current sensor. It offers an upgrade path for HybridPACK™ DSC S1 modules targeting inverter designs up to 75 kW power range at up to 320 Arms capability.

Key features

• Blocking voltage 750 V
• Nominal collector current (I_C) 450 A
• Operating temperature T_{VJ OP}: 150 °C
• EDT2 chip technology optimized in the range of 10 kHz switching frequencies

Additional features

• Electrical:
  • Short-time extended T_{VJ OP}: 175 °C
  • On-chip temperature sensor
  • On-chip current sensor
  • 2.5 kW AC 1 min at 50 Hz insulation
  • Low inductive design (15 nH)
  • Low switching losses
• Mechanical:
  • Double-sided cooling package
  • RoHS compliant
• Additional Benefits:
  • High current density enabling very compact and cost-efficient inverter designs
  • Superior efficiency by EDT2 technology for excellent light load power losses (20% improved compared to IGBT3)
  • Highest reliability by short circuit ruggedness and increased blocking voltage (V_CES = 750 V)
  • Superior thermal performance (Double-sided cooled molded half-bridge module and Short-term 175 °C chip junction temperature operating capability)
  • Fully qualified for Automotive (AQG324)

Applications

• Main Inverter
• Hybrid und Battery Electric Vehicles
• Commercial, Construction and Agriculture Vehicles

Additional Info

• Ramp-up and field experience (vs. new competitor molded modules):
  • Off-the-shelf solution for a short time to market
  • Proven package with over 3.5 million modules used in various hybrid and plug-in hybrid cars around the world
• Security: On-chip temperature and current sensor allowing faster reaction time on e.g. over-temperature die protection
• System integration due to compact product design and flexible half-bridge concept
• Scalability: upscale possibility to existing HybridPACK™ DSC S1 (FF400R07A01E3_S6) at same package outline
• V_CES 750 V supports advancements in battery technology towards higher V DC-link up to 450 V
• Integrated isolation: modules can be directly attached to a cooler without external isolation