New Product Introduction

Infineon Technologies EasyPACK™ CoolSiC™ automotive MOSFET

EasyPACK™ 1B is a 7.33 mΩ half-bridge module combining the new CoolSiC™Automotive MOSFET 1200V technology, an NTC temperature sensor, and the proven PressFIT

Infineon Technologies EasyPACK CoolSiC product image

EasyPACK™ 1B is a 7.33 mΩ half-bridge module combining the new CoolSiC™Automotive MOSFET 1200V technology, an NTC temperature sensor, and the proven PressFIT contact technology. With the full automotive qualification, the field of applications for CoolSIC™ is now extended to high voltage automotive applications with high efficiency and switching frequency requirements, such as HV/HV DC-DC step-up converters, multiphase inverters, and fast-switching auxiliary drives like fuel-cell compressors.

 

Key features

  • High gate threshold voltage preventing parasitic turn-ON (Vth = 4.4 V)
  • IGBT compatible driving voltage (VGS = -5/+15 V)
  • Intrinsic diode with low reverse recovery
  • RDS(ON) = 7.33 mΩ (typical)

 

Additional features

  • Low stray inductance 5 nH
  • Blocking voltage 1200 V
  • Low switching losses
  • Low Qg and Crss
  • Tvjop = 150 °C
  • Integrated NTC temperature sensor
  • RoHS compliant
  • Easy system assembly (PressFIT contact technology for solder-less mounting)
  • Easy design (Integrated module solution with optimized thermal management)
  • Superior reliability (gate oxide and cosmic ray robustness)
  • Flexibility (half-bridge concept for flexible inverter design)
  • Automotive qualified according to AQG 324

 

Applications

  • Hybrid and Electric Vehicles
  • Commercial, Construction and Agriculture Vehicles
  • HV/HV DC-DC Converters
  • Main Inverters
  • Auxiliary Drives

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