Nexperia LFPAK33 Trench 9 Automotive MOSFET

LFPAK33 provides the benchmark in low-resistance, small-footprint packaging, providing up to 80% space saving compared to traditional DPAK alternatives

With ever-increasing pressure to reduce the size of modules while at the same time increasing their functionality, LFPAK33 provides the benchmark in low-resistance, small-footprint packaging, providing up to 80% space saving compared to traditional DPAK alternatives. Bringing Nexperia's robust and reliable copper clip technology to the Power33 (3.3 mm x 3.3 mm) footprint, qualified to AEC-Q101 standards. The Nexperia LFPAK33 Trench 9 Automotive MOSFET portfolio is suitable for automotive applications such as powertrain, body control, and chassis and safety. Nexperia's broad released 40 V portfolio offers R_DS(ON) from 3.3  to 20 mΩ.

 

Key features

• Fully automotive AEC-Q101 qualified to 175 °C
• Ultra-campact footprint down to 10.9 mm2
• Logic Level and Standard Level gate
• Clip bond LFPAK33 package

 

Additional features

• Combination of Trench 9 silicon technology and in clip bonded LFPAK33 package
• Products offer low switching losses and low R_th performance
• Benchmark R_th for thermally demanding applications
• Strong fault condition tolerance due to technology features
• Ultra-low height less than 1 mm²
• Footprint 84% smaller than DPA
• Up to 80 A per device
• High transient robustness

 

Applications

• Powertrain pumps & motors (oil, water, fuel)
• Engine fans and pumps (BLDC & DC Motors)
• Solenoid Control
• Reverse battery protection
• Auxiliary loads & motor control
• Body Control
• Chassis and Safety

ebv content library/npi/2020/nexperia-lfpak33-trench-9-automotive Nexperia LFPAK33 Trench 9 Automotive | EBV Elektronik