Infineon Technologies HybridPack™ drive family

The HybridPACK™ Drive Family offers 3 variants of power modules for main inverters with a selection of collector current and blocking voltage: 660 A/750 V, 770 A/750 V, 820 A/750 V. Additional variants: 950 A/750 V and 380 A/1200 V, coming in Q3 2019.

Adapted baseplate structure for different cooling types. Flat baseplate without direct cooling structure, Pinfin for best cooling performance and Wave (Ribbon Bond) for a cost-effective solution between low and high performance.

One gate driver PCB fits all module variants, keeping the same module footprint.

Key features

• 750 V EDT2 IGBT for up to Tvj = 175 °C switching operation
• Variety of performances due to different cooling interfaces
• Mechanical guiding elements and press-fit pins for the signal terminals
• Compact and cost efficient Inverter design

Additional features

• Benchmark IGBT chip with higher density and lower switching losses
• Reuse of existing package technology
• Broad portfolio of modules for different performance classes
• Support easy assembly processes

Applications

• Hybrid electrical vehicles (H)EV
• Motor drives
• Commercial agriculture vehicles