Infineon Technologies CoolSiC™ MOSFET 62 mm module

CoolSiC™ MOSFETs reduce the system complexity leading to lower system cost and size in mid to high power systems. Thanks to the outstanding material properties of SiC, solutions which have been possible in the low-voltage world (< 600 V) are now feasible at higher voltages as well. Thanks to the superior trench technology in combination with the thick gate-oxide, CoolSiC™ MOSFETs offer the highest reliability. In addition, our CoolSiC™ body diode is long-term stable and does not drift and made for application where Silicon IGBT technology reaches its limits.

Key features

• 1200 V Silicon Carbide trench technology
• Highest gate-oxide reliability
• With and without pre-applied thermal interface material (TIM)
• 4 baseplate mounting holes

Additional features

• Half-bridge configuration
• Low inductive module design of typically 20 nH and symmetrical internal construction
• High speed switching module with very low losses

Applications

• EV charging
• Energy storage
• Solar central
• Aux. power supply for traction
• Server & IT infrastructure
• Commercial cooking