Nexperia Trench 9 low mΩ MOSFETs , in an LFPAK56(E) package

Nexperia’s latest AEC-Q101 Trench 9, 40 V automotive superjunction MOSFETs in the rugged, electrically- and thermally-efficient LFPAK56 deliver improved performance and reliability along with a footprint reduction of up to 81% when compared to traditional solutions. As well as reducing RDS(on) to below 1 mΩ, the new devices feature an improved DC current rating of 220 A. This enables higher power density on a small footprint, particularly valuable for safety-critical automotive applications requiring dual redundant circuitry.

Key features

• Very robust super junction technology with exceptional SOA
• Improved efficiency and power density
• Tight Vth limits enables easy paralleling of MOSFETs
• Enhanced LFPAK56E improved RDS(on) and power density

Additional features

• Fully automotive qualified to AEC-Q101:
   
• 175 °C rating suitable for thermally demanding environments

• Trench 9 Superjunction technology:

• Reduced cell pitch enables enhanced power density and efficiency with lower RDSon in same footprint
• Improved SOA and avalanche capability compared to standard TrenchMOS
• Tight VGS(th) limits enable easy paralleling of MOSFETs

• LFPAK Gull Wing leads:

• High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike traditional QFN packages
• Visual (AOI) soldering inspection, no need for expensive x-ray equipment
• Easy solder wetting for good mechanical solder joint

• LFPAK copper clip technology:

• Improved reliability, with reduced Rth and RDSon
• Increases maximum current capability and improved current spreading

Applications

• Motor control (Brushed and Brushless)
• Power steering and Transmission control
• ABS and ESC (electronic stability control)
• Pumps: water, oil & fuel pumps
• Reverse battery protection
• DC/DC converters