Infineon TRENCHSTOP™ advanced isolation

EBV presents TRENCHSTOP™ fully isolated TO-247 package concept, which is able to match the highest requirements in terms of performance, design flexibility and ease of handling. By eliminating the need for thermal grease or thermal interface sheets the TRENCHSTOP™ Advanced Isolation is able to deliver at least 35% lower thermal resistivity and at least 10% system cost reduction, helping designers to lower system complexity, development time, and assembling costs.

First wave launch four IGBTs with TRENCHSTOP™ HighSpeed 3 technology and one Rapid switching 650 V emitter controlled diode.

Key features

• Fully Isolated package
• Top class R_th(j–h)
• Low coupling capacitance
• Lower assembly costs

Additional features

• Fully Isolated package (Plug & play solution,100% isolated,Viso: 3.0kV for 1 sec)
• Top class R_th(j・h)(35% lower Rth(j-h) compared to Iso-foil, 50% lower R_th(j-h) compared to Full-Paks)
• Low coupling capacitance (38pF, 36% lower than standard Isolation foils, 25% lower than MICA, similar to Al2O3)

Benefits:

• Lower assembly costs
  • No need to use isolation material and thermal grease
  • 35% reduction in assembling time compared to standard TO-247 with Iso-foils
• Improved reliability
  • Increased yield eliminating misalignments of isolation foils
• Decreased heatsink size or increased power density
  • Up to 10°C lower Tc compared to standard TO-247 with isolation material
  • Up to 20% Iout increase for higher power output
• Decreased EMI filter size & decreased system costs
• Improved reliability
  • Complete manufacturing process control
  • Easy paralleling

Applications

• AirCon
• MHA
• GPI
• UPS
• Welding
• Solar