Infineon Prime Block - solder bond technology
Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must
Infineon Technologies Bipolar extends its product portfolio of thyristor/diode modules in solder bond technology with higher current ratings. The 50 mm Prime Block modules cover now current ratings of 390 A and become best in class. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must.
Key features
- Optimized thermal design
- Best in class current rating in 50 mm foot print
- 50 mm foot print available with TIM
- Increased power density
Additional features
- Predictably high performance and lifetime due to 100% x-ray monitoring
- Solid base plate for fast and easy mounting
- Optimized for less performant heat sinks
Applications
- Drives
- Welding
- UPS
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